Atmospheric Pressure Cold Plasma Processing Workshop

apg — Wed, 1 Jul 2009 07:19:57 -0700

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Background: Atmospheric pressure cold plasma is finding applications in processes requiring low temperature, minimal use of harsh chemicals, and minimal effluence.

Objectives:
1) Synergistic networking for researchers considering the application of atmospheric pressure cold plasma processing in their discipline;
2) Attracting interdisciplinary expertise to this new field of plasma-assisted processing;
3) Identifying research hurdles and challenges; and
4) Facilitating formation of research teams and writing of proposals.

Date: Tuesday July 21
Time: 1:00

Location: CUB Junior Ballroom at WSU Pullman (CUB 210)

Co-hosted by:

Mesh Network Monitors Volcanoes: Sensors dropped onto Mount St. Helens relayed data after forming an ad-hoc network.

alli — Tue, 30 Jun 2009 09:59:51 -0700

Blog by Kristina Grifantini of Technology Review
Today kicks off the three-day MobiSys 2009 conference in Krakow, Poland--a showcase of emerging mobile and wireless technology. And one paper that caught my eye comes from Washington State University and the U.S. Geological Survey. WSU Researchers will present a paper that shows how an air-dropped mesh sensor network can monitor volcanoes in real time.

Pande Receives Prestigious NSF CAREER Award

alli — Mon, 29 Jun 2009 15:43:14 -0700

PULLMAN, Wash – Partha Pratim Pande, assistant professor in the School of Electrical Engineering and Computer Science, has received a prestigious National Science Foundation CAREER award to design a tiny and sophisticated wireless communications system – all on an integrated circuit that measures only about 20 millimeters on each side.

With the five-year, $450,000 award, Pande and his research group are working to develop a wireless network on a multicore computer chip. With hundreds of computer processors on present-day integrated circuits, the conventional metal wires that connect them have become an increasing problem. The traditional metal wire-based communication between two distant cores in a single chip gives rise to high latency and energy dissipation.